Description
Key Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer | LAM Research |
| Part Number | 853-049542-173 |
| Board Type | ASSY TEMP CONT 24-CHANNEL |
| Control Type | Control Type 3 reported |
| Channel Count | 24 |
| Primary Function | Multi-channel temperature monitoring and control |
| Associated P/N | 810-028295-173 |
| Equipment Domain | Semiconductor wafer-processing equipment |
| Installation | Equipment node/backplane assembly |
| Application | Chamber/heater thermal management |
| Component Form | PCB assembly / node board |
| Lifecycle | Legacy semiconductor equipment spare |
The strongest matching references describe the part specifically as “ASSY TEMP CONT 24-CHANNEL” rather than as a generic PLC or DCS I/O board.
Product Introduction
LAM Research 853-049542-173 Temperature Controller Overview
The LAM Research 853-049542-173 is a 24-channel temperature-control PCB assembly used in semiconductor processing equipment. Its job is associated with monitoring and controlling multiple thermal zones, where temperature stability directly affects chamber operation and process repeatability.
This is specialized equipment hardware. It should not be evaluated like a generic temperature controller. The board interfaces with the host tool’s node architecture, so the exact tool configuration, board revision, harness arrangement, and control software compatibility matter when selecting a replacement.
853-049542-173
Application Scenarios & Field Pitfalls
Engineering Pain Point
A thermal-control board can fail without producing an obvious catastrophic hardware alarm. One channel may drift, report an open sensor, lose heater control, or behave intermittently. On a semiconductor tool, that can translate into chamber qualification failures, unstable process temperature, or repeated wafer-processing interruptions.
The first diagnostic step should be separating a board fault from a sensor, heater, harness, or backplane fault.
Typical Applications
- Semiconductor Etch Equipment — Multi-zone chamber temperature control
- Deposition Equipment — Heater-zone monitoring and thermal regulation
- Wafer Processing Systems — Independent temperature sensing across process zones
- Legacy Lam Research Tools — Replacement of aging 24-channel temperature-control assemblies
Technical Pitfalls to Avoid
- Verify the complete part number.
853-049542-173 and 810-028295-173 are repeatedly associated with the same temperature-control assembly, but cross-reference claims should still be checked against the actual equipment BOM. - Do not blame the PCB before checking the thermal loop.
An apparent controller failure can originate from a thermocouple, heater element, harness, connector, or node backplane. Check the complete signal path. - Inspect connector condition carefully.
A partially seated temperature-sensor harness can produce multiple channel faults at once. Connector damage or contamination can also create intermittent readings. - Verify calibration after replacement.
Twenty-four independent channels mean twenty-four opportunities for scaling or calibration errors. A replacement board should be validated against the tool’s approved temperature-control procedure before production release. - Do not assume another revision is a drop-in replacement.
One current reference claims 853-049542-174 as a related revision, while other sources identify different associated assemblies. Treat revision changes as engineering compatibility questions, not simple suffix changes.
Related Products
- LAM Research 810-028295-173 — Frequently associated with 853-049542-173 and described as an alternate/subassembly reference for the 24-channel temperature-control board. Verify the exact equipment BOM before substitution.
- LAM Research 810-028296-173 — Appears in component listings alongside the 853-049542-173 temperature-controller assembly. Treat it as a related assembly reference rather than assuming electrical interchangeability.
- LAM Research 810-028298-004 — Listed in connection with 853-049542-173 assemblies. Useful during legacy spare identification, but the functional relationship should be confirmed from the tool BOM.
- LAM Research 853-049542-172 — Closely numbered LAM part appearing in the same component family. The similar suffix does not establish direct replacement compatibility.
- LAM Research 810-800256-207 — A Lam node-board part associated by some current listings with legacy TCP/etch equipment and several cross-reference numbers. Because the functional descriptions conflict across sources, verify the equipment-specific BOM before using it as an alternative.
- LAM Research 810-800256-107 — Node-board assembly identified as a Control Type 3 board in current Lam component inventories. It is relevant to legacy node architecture but should not be treated as a substitute for the 24-channel temperature controller without documentation.
- LAM Research 810-802902-207 — Node2 motherboard used within Lam equipment architecture. It is a supporting system-level board rather than a replacement for the temperature-control assembly.
- LAM Research 810-072906-006 — Another Lam Research PCB used in semiconductor equipment. Relevant as a broader legacy-spare reference, but it has a different board function.
Procurement Note: I would specify this part as LAM Research 853-049542-173, ASSY TEMP CONT 24-CHANNEL and request confirmation of the equipment model, board revision, Control Type, and associated 810-series number before shipment. The 24-channel identification is well supported, but several online databases mix unrelated technical descriptions with this part number.
